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ID-1S Inline Laser Inspection System
Solder-Paste Printing Inspection
The Malcom ID-1S Inline Laser Inspection System offers full in-line inspection
of printed solder paste height, width, and volume. SPC data-management software allows
operator to determine if process is within specified limits. High resolution digital
camera and automatic board-warpage compression, using motor driven fixing pins, allows
accurate measurement of ultrafine-pitch SMDs and BGAs, on large boards up to 18in x 14in.
Wide laser path and large field of view allows inspection of an entire BGA in a single
pass, resulting in faster inspection times. Other features include Windows NT operating
software, and SPC Data management software.
- The ID-1S provides Statistic Process Control Data, "SPC". In the SPC, the operator will see graphs, histogram, and data. All of this information comes from raw data collected in Auto Inspection Setting. Our SPC is very clear and user friendly. The operator is able to track the measurement of the individual pad.
The ID-1S uses new 3-D graph rendering. Here are a few pictures of the new 3-D color
profiles.
Criteria for Passing or Failing Tests
| Number of pads | If the number of pads is less or not |
| Shear | Shear of solder paste acreage center and position |
| Excess paste | The height is larger than maximum height; the height is larger than maximum average height |
| Loose | The area is smaller than minimum area. The width is smaller than minimum width, smaller than average width |
| Blurred | The height is lower than minimum average height |
| Bridge | Pad number is smaller, and the pad area is larger than maximum average width |
| Drop | The area is larger than the maximum; the width is larger than the
maximum; larger than maximum average width |
| Volume | Area x Average Height |
