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TK-1 Solder Paste Tackiness Tester
The Malcom TK-1 Tackiness Tester is widely used to help our customers predict
solder paste tack time, limiting the potential for dropped components, using either the
IPC, Depth Method, or JIS Standard Test. These three convenient testing methods for
tackiness allows you to determine component drop time to loss of adhesion, and thus
avoiding costly rework. Tackiness refers to combined force of the cohesion and adhesion.
In many cases, chip parts are held on the board by the paste's tackiness during reflow. It
is at this time that defects occur from chips falling off the board; or being displaced by
the vibration of the chip mounter after some time has elapsed, since printing or when
tackiness is reduced by reflow heat.
Features and Benefits
- Quantifies solder-paste tackiness.
- Determines component drop-time, thus reducing costly rework.
- Three testing methods available.
- User-variable measurement conditions (time, preload, depth, and speed).
- Digital display of measured tackiness, real preload, and real insertion depth.
- Online computing capable with included PC software.
Specifications
| Sensor range | 0 - 500 gf |
| Sensor resolution | 1 gf |
| Measurement methods | Continuous preload, JIS Point Preload, IPC Insertion depth |
| Parameters measured | Tackiness: 0 - 500 gf Preload: 0 - 500 gf Insert depth: 0 - 200 mu meters |
| Preset ranges | Preload: 20 - 500 gf Time: 0.1 - 99.9 sec Speed: 0.1 - 10.0 mm/sec 0.2 - 9.9 mm/min Depth: 20 - 200 mu meters |
| Outputs | Analog: 1 gf/10mV Digital: RS-232C |
| Accessories | Hand printer with 0.2 mm mask test piece, 5.1-mm diameter probe control and data analysis software |
* Specs subject to change without notice.
