The Malcom TK-1 Tackiness Tester is widely
used to help our customers predict solder paste tack time, limiting the
potential for dropped components, using either the IPC, Depth Method, or JIS
Standard Test. These three convenient testing methods for tackiness allows you
to determine component drop time to loss of adhesion, and thus avoiding costly
rework. Tackiness refers to combined force of the cohesion and adhesion. In many
cases, chip parts are held on the board by the paste's tackiness during reflow.
It is at this time that defects occur from chips falling off the board; or being
displaced by the vibration of the chip mounter after some time has elapsed,
since printing or when tackiness is reduced by reflow heat.
Specification
Sensor range
0 - 500 gf
Sensor resolution
1 gf
Measurement methods
Continuous preload, JIS
Point Preload, IPC Insertion depth