The Malcom SP-2 Wetting Tester helps to
test the wettability of solder paste and components while actually simulating
the SMT mounting and reflow process. The SP-2 simulates the actual temperature
that solder paste undergoes during preheat and reflow, letting you easily
identify any deficiencies in flux activity or components wettability.
Measurement of the solder paste wettability, components wettability, printed
board wettability, wettability on temperature rise, and wettability on
preheating time. By actual simulation of the SMT mounting and reflow process
with standard variable, it is possible to develop an accurate, repeatable
evaluation method to determine a solder paste's solderability.
-5.00 gf - +10.00 gf
+/- 0.01 gf for 1 gf range
+/- 0.05 gf for 10 gf range